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Fully Encapsulating Dielectrics for Gaseous Helium Cooled Superconducting CORC Power Cables

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N00253-16-P-0238
Agency Tracking Number: N16A-011-0132
Amount: $80,000.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: N16A-T011
Solicitation Number: 2016.0
Solicitation Year: 2016
Award Year: 2016
Award Start Date (Proposal Award Date): 2016-06-08
Award End Date (Contract End Date): 2016-12-05
Small Business Information
3082 Sterling Circle
Boulder, CO 80301
United States
DUNS: 969353734
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Danko van der Laan
 (720) 933-5674
Business Contact
 van der
Phone: (720) 933-5674
Research Institution
 Florida State University - Center for Advanced Pow
 Sastry Pamidi
2000 Levy Ave
Tallahassee, FL 32310-5708
United States

 (850) 644-1447
 Nonprofit College or University

Future power systems on board Navy ships require electrical power in the order of 20 to 80 MW, which currently cant be provided by conventional copper or aluminum power cables. Advanced Conductor Technologies LLC (ACT) has been developing high-temperature superconducting Conductor on Round Core (CORC) power transmission cables, rated at 10 kA per phase, for the Navy that form a potential solution in which the required power can be transported in a lightweight and low-loss system. A significant challenge that needs to be overcome for CORC cables cooled with cryogenic helium gas is the ability to operate the cables at voltages exceeding 1 kV. Advanced Conductor Technologies, together with the Center for Advanced Power Systems (CAPS) at the Florida State University (FSU) and Georgia Institute of Technology propose to develop fully encapsulating dielectrics for use in cryogenic helium gas, enabling voltage operation of 20 kV, providing the CORC cable with a power rating of as high as 200 MW. We will determine feasible dielectric materials and application methods that would prevent helium penetration into the dielectric and would result in a robust and cost-effective fully encapsulated dielectric.

* Information listed above is at the time of submission. *

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