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Microelectronics Component Adhesive Selection and Design Rules for Failure Avoidance

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0147-16-C-7809
Agency Tracking Number: B2-2299
Amount: $998,041.00
Phase: Phase II
Program: STTR
Solicitation Topic Code: MDA14-T002
Solicitation Number: 2014.0
Timeline
Solicitation Year: 2014
Award Year: 2016
Award Start Date (Proposal Award Date): 2016-07-18
Award End Date (Contract End Date): 2018-07-17
Small Business Information
701 McMillian Way NW
Huntsville, AL 35806
United States
DUNS: 185169620
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: Yes
Principal Investigator
 J. Vernon Cole
 (256) 726-4852
 proposals-contracts@cfdrc.com
Business Contact
 Deborah Phipps
Phone: (256) 726-4884
Email: deb.phipps@cfdrc.com
Research Institution
 University Research Foundation
 Dr. Norris Krone, Jr.
 
6411 Ivy Lane Suite 106
Greenbelt, MD 20770
United States

 (301) 345-8664
 Nonprofit college or university
Abstract

Thermally induced fatigue and residual stress introduced during fabrication are sources of failure in microelectronics, which raises reliability concerns for MDA and its system integrators. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a physics based modeling and testing protocol to correlate material properties and thermal loading conditions to stress related failure. Specific outcomes include; (a) experimental evaluation of adhesive bond performance under thermal stress conditions, (b) development and application of a testing protocol to quantify the coefficient of thermal expansion (CTE) mismatch necessary to elevate stress to cause degradation, (c) physics based models to simulate thermo-mechanical stress between bonded components, and (d) a fine scaled physics based damage model to relate thermo-mechanical stress to damage progression. This effort includes the development of the test and modeling protocols, generation of data to parameterize models and application of the models to the study of thermal fatigue in adhesive bonded components. The end use of the modeling and testing protocol is to extract design rules and materials selection guidelines to allow MDA and its prime contractors to mitigate component failures related to CTE mismatch through improved designs and materials selection and with reduced long-duration cyclic testing.

* Information listed above is at the time of submission. *

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