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High Power Solid-State Amplifier for PIP-II

Award Information
Agency: Department of Energy
Branch: N/A
Contract: DE-SC0015780
Agency Tracking Number: 0000223871
Amount: $149,878.57
Phase: Phase I
Program: SBIR
Solicitation Topic Code: 25
Solicitation Number: DE-FOA-0001417
Solicitation Year: 2016
Award Year: 2016
Award Start Date (Proposal Award Date): 2016-06-13
Award End Date (Contract End Date): 2017-03-12
Small Business Information
35 Wiggins Avenue
Beford, MA 01730-2345
United States
DUNS: 602959579
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Neal Butler
 (781) 275-9444
Business Contact
 Michael Kempkes
Phone: (781) 275-9444
Research Institution

Statement of Problem & DOE/Public Interest: Klystrons, magnetrons, and other vacuum tubes have traditionally been used for high power applications, but the increasing transition of low power amplifiers to solid-state has significantly reduced the industrial base. Very high power transistorized RF amplifiers are promising for future DOE accelerators, but their complexity and cost must be reduced and reliable operation at high power must be demonstrated.
How the Problem Will Be Addressed: A novel solid-state amplifier based on an integrated resonant cavity combiner will combine the power output of many high power transistors in one step. The simple and rugged configuration leads to massive reductions in the complexity of RF connections and coolant lines. These improvements will reduce cost and improve field reliability. Phase I Work: In Phase I, DTI will develop and implement a low cost 650 MHz solid-state amplifier operating with high efficiency and ruggedness. Commercial Applications/Benefits: The new technology will be applicable to users of high power RF and microwave sources. This includes widespread industrial microwave heating applications, radar, as well as many scientific applications in addition to particle accelerators. Key Words: resonant cavity combiner, solid-state RF

* Information listed above is at the time of submission. *

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