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Radiation Hardened Optoelectronics for Optical Interconnects
Award Information
Agency: Department of Defense
Branch: Defense Threat Reduction Agency
Contract: HDTRA1-16-P-0018
Agency Tracking Number: T152-001-0042
Amount:
$149,761.00
Phase:
Phase I
Program:
SBIR
Solicitation Topic Code:
DTRA152-001
Solicitation Number:
2015.2
Timeline
Solicitation Year:
2015
Award Year:
2016
Award Start Date (Proposal Award Date):
2016-03-07
Award End Date (Contract End Date):
2016-10-06
Small Business Information
990 Park Center Drive, Suite H
Vista, CA
92081
United States
DUNS:
199060521
HUBZone Owned:
No
Woman Owned:
No
Socially and Economically Disadvantaged:
No
Principal Investigator
Name: Charlie Kuznia
Phone: (760) 420-3486
Email: ckuznia@ultracomm-inc.com
Phone: (760) 420-3486
Email: ckuznia@ultracomm-inc.com
Business Contact
Name: Charlie Kuznia
Phone: (760) 420-3486
Email: ckuznia@ultracomm-inc.com
Phone: (760) 420-3486
Email: ckuznia@ultracomm-inc.com
Research Institution
N/A
Abstract
This program develops innovative technology for chip-to-chip and intra-chip interconnects that will operate in extreme radiation environments.There is considerable development in chip-to-chip and intra-chip interconnects in the commercial market.This program will leverage these advancements and demonstrate their applicability to satellite and unmanned avionic vehicles (UAV) platforms.
* Information listed above is at the time of submission. *
