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Fast-Framing Hybrid Pixel Array Detector for Hard X-ray Measurements

Award Information
Agency: Department of Defense
Branch: Defense Threat Reduction Agency
Contract: HDTRA1-16-P-0019
Agency Tracking Number: T152-002-0090
Amount: $149,993.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: DTRA152-002
Solicitation Number: 2015.2
Solicitation Year: 2015
Award Year: 2016
Award Start Date (Proposal Award Date): 2016-03-15
Award End Date (Contract End Date): 2016-10-27
Small Business Information
291 Millstead Way
Rochester, NY 14624
United States
DUNS: 167029235
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Jaime Farrington, Ph.D.
 (585) 278-1168
Business Contact
 Mark Katafiaz
Phone: (585) 278-1168
Research Institution

The capabilities of modern x-ray light sources have opened up new areas in the study of the temporal evolution of complex materials under dynamic loading, which require detectors with high sensitivity, wide dynamic range at frame rates approaching the bunch repetition rates of modern light sources and detection at x-ray energies above 20keV.However, the capability to do such research is limited by the current detector technology. Sydor Instruments, in collaboration with Cornell University will advance the development of a fast framing hybridized x-ray imaging detector to fulfill these needs based on an existing detector platform developed by the Cornell Detector Group called the Keck PAD, which is proven capable of acquiring up to 12 successive x-ray images at frame rates of ~7MHz with single x-ray sensitivity and with a dynamic range exceeding 103x-rays/pixel/frame. The current Keck PAD capabilities will be extended to x-ray energies above 20keV by replacing its Silicon sensors with Cadmium Telluride sensors.The prototype detector performance will be characterized to demonstrate the feasibility of developing high energy x-ray detectors to meet detector needs for emerging applications in the study materials under dynamic loading. In parallel, other sensor material developments will be tracked to assess future potential.

* Information listed above is at the time of submission. *

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