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Through-Lens Fiducial Marking System



OBJECTIVE: Develop a tool for through-lens fiducial marking on the backside of semiconductor devices. 

DESCRIPTION: Infrared (IR) Microscopes are used in the Failure Analysis (FA) and Fault Isolation (FI) of semiconductor devices because of the fact that silicon is transparent to near-IR (NIR) light. Some of these microscopes use Charge-Coupled Device (CCD) Cameras that are specifically designed for the NIR wavelengths, and others use a NIR wavelength laser with a scanner. These tools are used to find specific areas of interest, and often these parts will then be milled with a Focused Ion Beam (FIB) in order to do further analysis. One of the difficulties is that without a Graphic Database System (GDS) layout for navigation in both systems, there is no way of accurately finding the exact same location in both the IR microscope and FIB. The innovative development of a tool that can be integrated into an IR microscope that is able to create a fiducial marker on the surface of the backside silicon is desired. 

PHASE I: Perform a study on different methods for creating fiducial markers on silicon. The study should be focused on tool innovation and identifying possible components that would be required to build a fiducial marking system. The goal of the innovation is to create a tool that is capable of creating a fiducial mark while looking at the sample in a backside IR microscope. The fiducial mark will be visible in both the IR microscope and FIB. Deliver a report of research and innovation, including a notional list of possible components and a storyboard of software that will control the tool, a list of all the facility requirements and a program plan for system development. If any of the above restraints cannot be adhered to, the report must include relevant research and rationale. If adhering to the above restraints is possible, but not financially feasible, the report must include relevant research and rationale. 

PHASE II: Based on the aforementioned study and applicable innovation, produce a fully functioning prototype that adheres to all the constraints listed above. Test the prototype and deliver along with at least two (2) samples. The samples should all be the same device (to be determined during Phase I), and should show the process repeatability between both samples. Deliver a complete Bill of Materials (BOM), including all components used, manufacturers, part numbers, quantities, technical datasheets, facility requirements, CAD drawings for each component and a complete CAD assembly for the completed prototype. 

PHASE III: There may be opportunities for further development of this system for use in a specific military or commercial application. During a Phase III program, offerors may refine the performance of the design and produce pre-production quantities for evaluation by the Government. The Through-Lens Fiducial Marking System would be applicable to both commercial and government semiconductor device research and FA. Government applications include FA and FI of semiconductors. Commercial applications include FA and FI of semiconductors. 


1: Eiji Yoshida, Tomohiro Tanaka, Taro Oyamada, Tohru Koyama, Junko Komori, Shigeto Maegawa. 3-D EBIC Technique using FIB and EB Double Beam System. ISTFA 2015. ISFTA 2005.

2: Laser Marking Technologies. Sintec Optronics PTE LTD. February 23, 2008.

3: Martin Geheran. The back-end process: Step 10 “ Laser marking. Solid State Technology. October 2001.


KEYWORDS: Infrared Laser, Laser Marking, Fiducial 

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