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Mechanistic Model Development for Gold Contaminated Solder Joint Reliability

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0147-16-C-7610
Agency Tracking Number: B15C-005-0044
Amount: $99,940.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: MDA15-T005
Solicitation Number: 2016.0
Timeline
Solicitation Year: 2016
Award Year: 2016
Award Start Date (Proposal Award Date): 2016-04-25
Award End Date (Contract End Date): 2016-11-24
Small Business Information
9000 Virginia Manor Road
Beltsville, MD 20705
United States
DUNS: 181660775
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Dr. Nathan Blattau
 (301) 640-5818
 nblattau@dfrsolutions.com
Business Contact
 Ed Dodd
Phone: (301) 640-3016
Email: edodd@dfrsolutions.com
Research Institution
 Rochester Institute of Technology
 Dr. Martin Anselm
 
One Lomb Memorial Drive
Rochester, NY 14623-5603
United States

 (585) 475-2005
 Nonprofit college or university
Abstract

DfR Solutions and the Rochester Institute of Technology (RIT) have formed a team of experts in solder joint reliability and gold embrittlement to perform a series of experiments that will provide the data necessary to create mechanistic reliability models. Critical to any application of these models and of interpreting experimental results is the ability to determine solder joint gold contamination percent by weight. Phase I will explore non-destructive methods for plating measurement and gold content calculation, and perform destructive analysis to verify the optimal method for determining gold content in solder joints of physical samples. The gold content prediction methodology derived during Phase I will provide the basis for establishing an effective design of experiments to determine the long term reliability effects of various levels of gold contamination. In Phase II and beyond, DfR Solutions and RIT will perform the required testing and create mechanistic reliability models. Prior experience developing solder joint reliability models and a history of creating tools for industry to apply them reduces program risk and provides a clear path to commercial application. Approved for Public Release 16-MDA-8620 (1 April 16)

* Information listed above is at the time of submission. *

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