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CCA-SAFE: A Model-Assisted NDE Tool for Failure Analysis of Gold Contaminated Solder Joints

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0147-16-C-7605
Agency Tracking Number: B15C-005-0074
Amount: $100,000.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: MDA15-T005
Solicitation Number: 2016.0
Solicitation Year: 2016
Award Year: 2016
Award Start Date (Proposal Award Date): 2016-04-25
Award End Date (Contract End Date): 2016-11-24
Small Business Information
15400 Calhoun Drive
Rockville, MD 20855
United States
DUNS: 161911532
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: No
Principal Investigator
 Dr. Kevin Qi
 (301) 294-5201
Business Contact
 Mark James
Phone: (301) 294-5221
Research Institution
 California Polytechnic State University
 Jianbiao John Pan, Ph.D., CQE, CRE
Building 192 Room 235 \N
San Luis Obispo, CA 93407
United States

 (805) 756-2540
 Nonprofit College or University

Gold contamination in Circuit Card Assembly (CCA) solder joints leads to brittle intermetallic compounds (IMCs), which is one of the major factors in solder joint failure. The conventional rule of thumb considers 3 wt% of gold (Au) as a safety threshold, which is not always reliable due to varieties of package platforms, solder types, reflux settings, operational and environmental conditions, etc. Accurate assessment of solder reliability requires physical understanding of solder behavior under realistic loads and boundary conditions. In this Phase I project, Intelligent Automation, Inc. proposes to develop a modeling and Nondestructive Testing (NDT) combined framework for Au content detection and solder failure likelihood prediction. In the proposed framework, NDT data of Au distribution will be imported into a multi-scale model integrating Finite Element Analysis (FEA) and Peridynamics (PD) for crack initiation and growth analysis. An efficient stochastic algorithm will be utilized to interrogate the numerical model in the random space, generating probabilistic failure prediction toward the target sample and operation condition. Feasibility of the proposed method will be evaluated on representative solder joint specimens with different levels of gold contents. Approved for Public Release 16-MDA-8620 (1 April 16)

* Information listed above is at the time of submission. *

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