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Gold-Contaminated Solder-Joint Characterization for Quantifying Risk Associated with Gold Embrittlement

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0147-16-C-7609
Agency Tracking Number: B15C-005-0075
Amount: $99,910.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: MDA15-T005
Solicitation Number: 2016.0
Solicitation Year: 2016
Award Year: 2016
Award Start Date (Proposal Award Date): 2016-04-25
Award End Date (Contract End Date): 2016-11-24
Small Business Information
4600 East West Hwy
Bethesda, MD 20814
United States
DUNS: 153640735
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Dr. Daniel Bentz
 (301) 680-8600
Business Contact
 Eric Enig
Phone: (301) 680-8600
Research Institution
 Sandia National Laboratories (SNL)
 Dr. Paul Vianco
P.O. Box 5800
Albuquerque, NM 87185
United States

 (555) 555-5555
 Nonprofit College or University

Circuit card assembly (CCA) reliability is dependent on solder joints, which join components to printed circuit boards (PCBs). Board users strive to mitigate risks associated with gold-embrittled solder joints. Enig Associates, Inc. (ENIG), in collaboration with Sandia National Laboratories, proposes to develop a risk-forecasting tool for quantifying the risks associated with gold-embrittled solder joints in electronic assemblies. The team will utilize existing Finite Element (FE) and kinetic Monte Carlo (KMC) tools and modeling approaches to predict the evolution of gold-embrittlement on PCB-level, surface mounted devices. FE models, developed in Comsol Multiphysics and/or ANSYS, will assess stress concentrations in the solder joint adhesion layer, as a function of time and as a result of fabrication and environmental stresses. KMC models will examine the dynamics of intermetallic diffusion in the solid and adhesion layer. Results will be used to estimate bonding area strength in the FE model and to evaluate solder joint performance under transient loads. Approved for Public Release 16-MDA-8620 (1 April 16)

* Information listed above is at the time of submission. *

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