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An Ultra-Compact Low-Power THz Radio SoC with On-Chip Antenna and Energy Harvesting

Award Information
Agency: Department of Defense
Branch: Army
Contract: W911NF-16-C-0127
Agency Tracking Number: A2-6374
Amount: $505,364.00
Phase: Phase II
Program: STTR
Solicitation Topic Code: A15A-T005
Solicitation Number: 2015.0
Solicitation Year: 2015
Award Year: 2016
Award Start Date (Proposal Award Date): 2016-11-16
Award End Date (Contract End Date): 2017-11-15
Small Business Information
1634 Presley Court
Auburn, AL 36830
United States
DUNS: 079712346
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: No
Principal Investigator
 Hua Wang
 (404) 385-6003
Business Contact
 Wendy Pu
Phone: (334) 524-1118
Research Institution
 Georgia Institute of Technology
 Amy Dowis, JD
Georgia Tech Research Corp. 505 10th Street, NW
Atlanta, GA 30332
United States

 (404) 894-0026
 Nonprofit College or University

There is an unmet demand for ultra-low-power, ultra-compact and low-cost radios to address emerging sensing and communication needs for military and commercial applications such as IoT/IoE. To overcome the limitations in existing bulky and power hungry radios, we propose a disruptive solution by integration of a nano-scaled THz transceiver, on-chip antenna, and energy harvesting circuits in a form-factor smaller than 1 cubic mm. The proposed THz radio can be reconfigured as a harmonic oscillator transmitter or a super-harmonic regenerative receiver. The information on received data and its power level is embedded in the oscillator transient waveform that can be detected and digitized using high performance time-to-digital converts (TDCs). This THz transceiver SoC substantially reduces the size and power while ensuring a data rate over 10Mbit/s for one meter range using OOK modulation. A multi-feed on-chip antenna performs on-chip THz power combining, splitting, and radiation, which further reduces the overall system size. Various energy harvesting technologies and their integration with the CMOS THz radio chip will be explored for integration with the transceiver circuits. The collaborative team includes Digital Analog Integration and Georgia Institute of Technology and offers related technical expertise, successful track records, and necessary facilities for the proposed research.

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