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VLSI CMOS-memristor Building-block for Future Autonomous Air Platforms

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8750-16-C-0183
Agency Tracking Number: F10B-T31-0248a
Amount: $719,817.00
Phase: Phase II
Program: STTR
Solicitation Topic Code: AF10-BT31
Solicitation Number: 2010.0
Timeline
Solicitation Year: 2010
Award Year: 2016
Award Start Date (Proposal Award Date): 2016-05-16
Award End Date (Contract End Date): 2018-05-16
Small Business Information
22B Stacy Rd
Santa Fe, NM 87505
United States
DUNS: 964588722
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Alex Nugent
 President
 (505) 988-7016
 alex@knowm.org
Business Contact
 Hillary Riggs
Title: Chief Administrative Officer
Phone: (505) 955-0998
Email: hillary.riggs@gmail.com
Research Institution
 Boise State University
 Kris Campbell
 
1910 UNIVERSITY DRIVE
BOISE, ID 83725
United States

 (208) 426-5968
 Nonprofit College or University
Abstract

The objective of this program is to build AHaH Computing demonstration chips and boards, establishing in the process the technical frameworks for a memristor wafer services business with the Idaho Microfabrication Laboratory (IML) at Boise State University (BSU), Dr. Kris Campbell at BSU, and other fabrication facilities. We believe that AHaH Computing and kT-RAM offer the most practical and robust solution to achieving integrated machine intelligence. However, there are a number of technologies that will be enabled via a Back-End-Of-Line (BEOL) CMOS Memristor service. Examples include alternate neuromemristive processors, stacked memory-on-top processors, reconfigurable logic, multi-state logic and memory, adaptive filters, physically unclonable devices, and more. Indeed, research into memristive circuits is growing exponentially. Our objective is therefore to create the tools we need to enable a future memristor wafer services business at the same time we demonstrate the last remaining technical milestones of AHaH Computing before chip production.

* Information listed above is at the time of submission. *

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