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Data Converter Systems on Chip

Description:

TECHNOLOGY AREA(S): Electronics 

OBJECTIVE: The objective of this topic is the design and development of highly efficient, multiple integrated data converters on a single integrated circuit chip. The integrated circuit chip/die shall be capable of withstanding harsh environments including but not limited to shock, vibe and extreme operating and storage temperatures. 

DESCRIPTION: Proximity Sensor Fuzing technologies have been around for a number of years now. The technology has been widely used and exported by the United States in various places around the globe. Proximity Fuze technology has the added capability of enhanced lethality over standard point detonating devices. Although current legacy technology is sufficient in most current systems, there is a desire to upgrade and digitize the signal processing chain of future systems. Digital systems tend to have a higher operational costs in terms of current draw, operating voltages and physical footprint that prohibit direct replacement of currently fielded systems without major re-designs or upgrades to power sources. This multi-phase effort will explore the ability of incorporating digital to analog and analog to digital data converters components onto one integrated circuit to essentially create a sensor on a chip. Specifically, the effort will include the design and development of efficient data converter devices along with associated required tooling, integration with FPGAs and fabrication/evaluation/delivery of prototype devices. The final resulting packaging shall be an improvement in size over using multiple individual data converter integrated circuits. A successful proposal will address how to optimize the size and power requirements of standard low power data converters while still packaging the die to survive high stress environments like shock, vibe and temperature extremes. 

PHASE I: Investigate serial data converters with the following minimum specifications: single supply operation of 3.3V, power consumption of less than 80mW at 8MSPS and 12 bits of resolution. From the market research, steps should be taken to develop initial performance requirements. Finally, develop the preliminary design architectures necessary to incorporate a single ADC block, with a dual DAC configuration that is capable of a serial interface to manipulate certain parameters to meet performance specs. 

PHASE II: Develop optimized configurations of the data converter blocks selected in the Phase I design activity. Design and fabricate prototype hardware that incorporate all the building blocks for a single integrated circuit chip. Conduct laboratory performance validation testing of the prototype design, showing the minimum capabilities and performance specifications determined in Phase I. Preliminary qualification and production test plans should developed to prove how the final deliverable would be tested to validate specifications were met in a production environment. 

PHASE III: The contractor shall develop tooling for the units and provide low quantities of demonstration prototypes to evaluate within laboratory environments. These prototypes would be used in relevant hardware designs to verify and validate the build of the integrated circuit. Projects where the chip can be implemented to verify design includes the Next Generation Proximity Sensor program. 

REFERENCES: 

1: J. S. Fisher, E. J. Murphy, S. B. Bibyk, "Design methods for system-on-a-chip control codecs to enhance performance and reuse", Proc. IEEE Nat. Aerosp. Electron. Conf., pp. 666-673, 2000.

2:  D. A. Johns, K. Martin, Analog Integrated Circuit Design, New York:John Wiley & Sons, Inc., pp. 531, 1997.

3:  R. van de Plassche, J Huijsing, Analog Circuit Design, New York:Springer Science+Business Media, LLC., 2000.

KEYWORDS: Fuze, Data Converters, RF Proximity Sensor, 

CONTACT(S): 

Patrick Deluca 

(973) 724-9453 

patrick.deluca.civ@mail.mil 

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