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Ultra-Compact Transmitter for Space-Based Lidar

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: 80NSSC17C0029
Agency Tracking Number: 150183
Amount: $749,898.00
Phase: Phase II
Program: STTR
Solicitation Topic Code: T9.01
Solicitation Number: N/A
Timeline
Solicitation Year: 2016
Award Year: 2017
Award Start Date (Proposal Award Date): 2017-09-27
Award End Date (Contract End Date): 2019-09-27
Small Business Information
13605 Dulles Technology Drive
Herndon, VA 20171-4603
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Nicholas Sawruk
 Laser Scientist, Senior
 (571) 299-4494
 nsawruk@fibertek.com
Business Contact
 Tracy Perinis
Title: Business Official
Phone: (703) 471-7671
Email: tperinis@fibertek.com
Research Institution
 Pennsylvania State University
 Tracy Perinis
 
230 Innovation Blvd.
State College, PA 16803-2241
United States

 (703) 471-7671
 Domestic Nonprofit Research Organization
Abstract

Fibertek, Inc. in partnership with researchers at the Pennsylvania State University Center for Innovative Materials Processing through Direct Digital Deposition (CIMP-3D) are proposing to develop a state of the art, space-qualifiable laser transmitter that meets the requirements of the flash lidar transmitter defined in the 2016 STTR subtopic T9.01, Navigation and Hazard Avoidance Sensor Technologies. The design will be an innovative synthesis of key technologies that results in a >3x reduction in the size and weight and a >2x increase in the efficiency of the laser transmitter previously developed for the Autonomous Landing and Hazard Avoidance Technology (ALHAT) demonstrator program . These key technologies include incorporation of additive manufacturing techniques to develop a much lighter weight mechanical structure, an ultra-compact unstable or near stable ring resonator that achieves a large fundamental mode, higher efficiency diode-pumped head designs that incorporate compact athermal pump architectures, and compact and efficient electronics designs derived from the environmentally hardened versions previously developed for DOD and NASA programs.

* Information listed above is at the time of submission. *

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