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Lithography Cost Reduction for Rad Hard Integrated Circuits

Award Information
Agency: Department of Defense
Branch: Defense Threat Reduction Agency
Contract: HDTRA1-17-C-0026
Agency Tracking Number: T2-0268
Amount: $991,958.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: DTRA143-008
Solicitation Number: 2014.3
Solicitation Year: 2014
Award Year: 2017
Award Start Date (Proposal Award Date): 2017-05-31
Award End Date (Contract End Date): 2019-05-21
Small Business Information
4568 South Highland Drive
Salt Lake City, UT 84117
United States
DUNS: 831704874
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Dr Michael Smayling
 VP of Advanced Technology
 (510) 690-7194
Business Contact
 Thomas Wolf
Phone: (801) 913-4332
Research Institution

The DoD faces mounting costs for integrated circuits built with advanced technology. Our proposal addresses mixed-signal ASIC design costs and fabrication costs, notably photomask costs and photolithography costs. The ADONIS 1D design methodology has been demonstrated at technologies ranging from 130nm to 16nm. In Phase I of the program, we used ADONIS to design a reference circuit a high-speed comparator in 16nm FinFET technology. The design was then tuned for Complementary E-Beam Lithography. The result was a 34% reduction in the number of exposures needed by the CEBL system, which would translate directly into reduced patterning time. The comparator design was released for fabrication at 16nm through the DARPA CRAFT program. In Phase II we are proposing to extend the work to include 200 logic cells, an SRAM instance, 20 mixed-signal functional blocks, a DICE-like differential amplifier, analog and digital circuits to implement chip specific writing, and a high-performance analog front end. The comparator from Phase I will also be bench tested. A testchip will be designed to demonstrate compatibility with the CEBL equipment. Finally, we look forward to Phase III in which we can productize our work with a DoD contractor partner like Northrup Grumman (our prime

* Information listed above is at the time of submission. *

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