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Ultra-low Diffusivity High Temperature Capable Insulation

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-17-C-0050
Agency Tracking Number: N151-079-0233
Amount: $1,499,933.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: N151-079
Solicitation Number: 15.1
Solicitation Year: 2015
Award Year: 2017
Award Start Date (Proposal Award Date): 2017-03-01
Award End Date (Contract End Date): 2021-11-13
Small Business Information
515 Courtney Way Suite B
Lafayette, CO 80026
United States
DUNS: 128688111
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Yiping Liu
 Materials Scientist
 (303) 516-9075
Business Contact
 Brian Schaible
Phone: (303) 516-9075
Research Institution

Hypersonic flight induces severe heat loads into airframe, control surfaces and internal assemblies. Thermal protection system (TPS) insulation materials must: be stable beyond 1200°C, be compact, resist evaporation and erosion/oxidation, and have low thermal diffusivity to limit heat transfer to support structures and internal electronics. There is a need for the reduction of insulation volumes and thermal diffusivity, and an increase in useful temperatures, as compared to the current state-of-the-art material used for ceramic TPSs. Sporian Microsystems proposes to develop SiCN based porous insulation materials, innovative textile architectures, and multilayer insulations (MLI) for ceramic matrix composite (CMC) thermal protection systems. Sporian has previously developed SiCN based polymer derived ceramics (PDC) for high temperature (1400-1800°C) applications, which have low thermal diffusivity/conductivity, low density, high strength, high fracture toughness, and thermal expansion coefficients (CTEs) matching common CMCs. In Phase I, Sporian developed and performed initial characterization of an ultra-low thermal diffusivity non-ablating insulator concept based on a polymer derived, amorphous, 1600 °C capable, SiCN ceramic. The Phase II effort will focus on completing primary technology development, rigorous lab-scale testing, and demonstrating larger-scale application-relevant components.

* Information listed above is at the time of submission. *

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