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Additive Manufactured Smart Structures with Discrete Embedded Sensors

Award Information
Agency: Department of Defense
Branch: Army
Contract: W56HZV-17-C-0184
Agency Tracking Number: A17A-024-0007
Amount: $149,962.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: A17A-T024
Solicitation Number: 2017.0
Solicitation Year: 2017
Award Year: 2017
Award Start Date (Proposal Award Date): 2017-08-30
Award End Date (Contract End Date): 2018-02-24
Small Business Information
United States
DUNS: 796010411
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 John Lovaasen
 (978) 856-4152
Business Contact
 Collette Jolliffe
Phone: (978) 856-4158
Research Institution
 University of Dayton Research Institute
 Brian Czapor
300 College Park
Dayton, OH 45469
United States

 (937) 229-4154
 Nonprofit College or University

The purpose of this proposal is to additively manufacture (AM) smart structures with embedded electronics such as sensors, accelerometers, antennas, etc. The goal of these smart structures will be to enhance the effectiveness and survivability of the Armys ground systems. The use of additive manufacturing smart structures provides flexibility in the materials used and the functionality of the electronics. Triton Systems plans to demonstrate the feasibility of embedding electronic sensing PCBs into the AM process, optimize the processing parameters to create a rugged product, and integration into metallic structures for Phase I. Integration of sensors and feedback loops will enable the interruption and addition of external parts (PCBs) during the AM process, without damaging the PCB or the final AM produced structure. Building upon Phase I results, the Phase II effort will include scaling up the processes to create a prototype system capable of fabricating 12 x 12 x 6 packages with improved electronic capability. During Phase III, effort will be focused on the process control and qualification of the prototype system, and the parts fabricated. A commercialization strategy and certification for integration into several vehicle platforms will also be developed.

* Information listed above is at the time of submission. *

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