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Affordable Integrated Circuit Packaging and Assembly for High-Temperature Intelligent Components

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8650-16-M-2709
Agency Tracking Number: F16A-T17-0043
Amount: $149,982.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: AF16-AT17
Solicitation Number: 2016.0
Solicitation Year: 2016
Award Year: 2016
Award Start Date (Proposal Award Date): 2016-06-29
Award End Date (Contract End Date): 2017-03-30
Small Business Information
4775 Centennial Boulevard, Suite 130
Colorado Springs, CO 80919
United States
DUNS: 619085371
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Mr. Stephen Philpy
 (719) 531-0805
Business Contact
 Ms. Karen Van Cura
Phone: (719) 531-0805
Research Institution
 Tennesse Technological University
 Dr. Wayne Johnson
1 William Jones Drive Array
Cookeville, TN 38505
United States

 (931) 372-3397
 Nonprofit College or University

Micro-RDC proposes to demonstrate the feasibility of developing low-cost, low-weight, reliable packaging materials and processes to produce low-power advanced Integrated Circuits (ICs) that can operate continuously at temperatures between -55C and +225...

* Information listed above is at the time of submission. *

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