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Test Article Printing with Laser Additive Manufacturing (TAP-LAM) for Threat Surrogate Target Production

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0147-18-C-7402
Agency Tracking Number: B17C-001-0022
Amount: $99,932.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: MDA17-T001
Solicitation Number: 2017.0
Solicitation Year: 2017
Award Year: 2018
Award Start Date (Proposal Award Date): 2018-03-28
Award End Date (Contract End Date): 2018-09-27
Small Business Information
711 E Monument Ave Ste 101
Dayton, OH 45402
United States
DUNS: 962006594
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Tom Tumolillo Jr
 (505) 238-1166
Business Contact
 Susie Engle
Phone: (937) 286-4819
Research Institution
 University of Dayton / UDRI
 Kari Howard
300 College Park
Dayton, OH 45469
United States

 (937) 229-3062
 Nonprofit College or University

Optonicus proposes development of the TAP-LAM (Test Article Printing with Laser Additive Manufacturing for Threat Surrogate Target Production) powder bed fusion and directed energy depositions systems. The TAP-LAM metal additive manufacturing system will advance strategic missile defense system testing capabilities by improving 3D printing methods to rapidly produce large-scale threat surrogate targets with identical material properties to those currently built with conventional, subtractive techniques. Through the use of proprietary multi-beam fiber-array laser systems the metal LAM material properties will be tailored to meet the strict tolerances required in high strain rate testing conditions. The proposed system will adapt high-power coherent fiber-array and adaptive beam control technologies originally developed for DoD directed energy applications. In Phase II, Optonicus will develop a fully functioning TAP-LAM-DED system, which will be used to quickly fabricate full and scaled test articles which will be delivered to MDA for further evaluation. Optonicus plans to commercialize this technology for DoD defense markets and civilian applications in Phase III.Approved for Public Release | 18-MDA-9522 (23 Feb 18)

* Information listed above is at the time of submission. *

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