High Performance 3D Photonic Integration for Space Applications

In this work, Freedom Photonics will team with University of California, Santa Barbara to develop a hybrid integration platform that integrates yielded, best-of-breed active optical components with low-cost, high functionality Silicon Photonics components in a manner that is compatible with foundry fabrication (such as AIM Photonics). This will be performed in a highly manufacturable manner, using passively aligned pick-and-place technology to place the semiconductor components on the interposer substrate to form a system in package-type of integration platform for photonic space applications. Using our novel 3D hybrid integration approach developed at UCSB, an integration technology that is scalable, low cost, reliable, and that demonstrates superior thermal performance is realized. The approach is based on flip-chip bonding and vertical coupling between InP and silicon waveguides.