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Low-Loss Commercial Deposition Technology for Thick Ferrites and Ferrite/Insulator Films on Printed Circuit Boards

Award Information
Agency: Department of Defense
Branch: Army
Contract: W911NF-18-C-0098
Agency Tracking Number: A2-7334
Amount: $500,000.00
Phase: Phase II
Program: STTR
Solicitation Topic Code: A16-020
Solicitation Number: 16.1
Solicitation Year: 2016
Award Year: 2018
Award Start Date (Proposal Award Date): 2018-09-28
Award End Date (Contract End Date): 2019-09-28
Small Business Information
21 A Street
Burlington, MA 01803
United States
DUNS: 829501225
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Xiaoling (Amy) Shi
 Member of Technical Staff
 (617) 910-0186
Business Contact
 Hui Lu
Phone: (978) 376-4205
Research Institution
 Northeastern University
 Justyna Szulc Justyna Szulc
360 Huntington Av, 409DA ECE Dept.
Boston, MA 02115
United States

 (617) 373-2561
 Nonprofit College or University

Integration of RF ferrites on printed circuit boards (PCBs) is highly desired for realizing compact, lightweight and low-cost systems with different RF ferrite components, including inductors, antennas and antenna arrays, etc. However, it has been challenging to integrate ferrites on PCBs. Spin spray deposition can produce fully dense, high crystalline quality, and low-loss RF ferrites at a low temperature at a low cost. However, spin spray technique and facilities are not commercially available. Two major challenges severely limit ferrite integration on PCBs by spin spray deposition: (1) limited ferrite film thickness of <5~10 µm; and (2) limited area of deposition on PCBs. Based on their extensive experience on spin spray deposition facilities, processes, ferrite materials, and RF ferrite devices, the PIs have developed new low-temperature spin spray and linear spray deposition technologies and processes for low-loss, high quality ferrite films and ferrite/insulator multilayers with large thickness >5~10 µm, low loss tangent <5% at >1GHz on PCBs, thus enabling low-temperature ferrite deposition large scale (36”×48”) PCB panels. At the same time, new compact integrated RF ferrite devices, including antennas and inductors have been demonstrated on ferrite coated PCBs. The project team is well positioned for the Phase II efforts.

* Information listed above is at the time of submission. *

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