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Smart Baseplate for Additive Manufacturing

Award Information
Agency: Department of Defense
Branch: Defense Logistics Agency
Contract: SP4701-18-P-0111
Agency Tracking Number: L18A-001-0004
Amount: $100,000.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: DLA18A-001
Solicitation Number: 2018.0
Solicitation Year: 2018
Award Year: 2018
Award Start Date (Proposal Award Date): 2018-09-19
Award End Date (Contract End Date): 2019-03-18
Small Business Information
301 1st Street SW
Roanoke, VA 24011
United States
DUNS: 627132913
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Kominsky, Daniel
 (540) 553-0865
Business Contact
 Michael Pruzan
Phone: (540) 769-8430
Research Institution
 Edison Welding institute
 Robert Kratzenberg
1250 Arthur E Adams Drive
Columbus, VA 43221
United States

 (614) 688-5157
 Domestic Nonprofit Research Organization

Additive manufacturing (AM) has rapidly evolved into a valuable technique for making parts which, at times, cannot be fabricated through conventional machining methods.One challenge in the area of AM is the lack of real-time feedback on the fabrication process and the quality of the part being made.This is especially critical given the relatively long periods of time that complex parts can require to construct.Hidden flaws in a part, which can be caused by excessive residual stresses, can result in the final part being unusable, wasting valuable time, resources, and AM machine life.This proposed work will develop a smart additive manufacturing (AM) baseplate for monitoring internal residual stresses and temperatures for multiple metal AM processes. This smart baseplate will allow monitoring unseen problematic areas by building a COTS distributed fiber optic sensing network directly into the baseplate with Ultrasonic Additive Manufacturing (UAM). The performance of this smart baseplate will be benchmarked using an open architecture selective laser melting (SLM) platform with installed external sensors for monitoring comparison purposes.

* Information listed above is at the time of submission. *

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