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Thickness Measurement Technology for Thin Films on Sapphire Substrate

Award Information
Agency: Department of Defense
Branch: Defense Microelectronics Activity
Contract: HQ072718C0008
Agency Tracking Number: 18-8K0
Amount: $999,999.00
Phase: Phase II
Program: STTR
Solicitation Topic Code: DMEA16B-001
Solicitation Number: 2016.0
Solicitation Year: 2016
Award Year: 2018
Award Start Date (Proposal Award Date): 2018-09-20
Award End Date (Contract End Date): 2020-09-30
Small Business Information
1046 New Holland Avenue
Lancaster, PA 17601
United States
DUNS: 126288336
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Nathan Van Velson
 (717) 205-0662
Business Contact
 Frank Morales
Phone: (717) 205-0637
Research Institution
 Iowa State University
 Xinwei Wang
2010 Black Engineering Building, Dept. of Mechnical Engineering
Ames, IA 50011
United States

 (515) 294-2085
 Domestic Nonprofit Research Organization

Silicon-on-sapphire (SOS) integrated circuits have achieved popularity due to their high speed performance and low power consumption in radio frequency applications. An important aspect of the SOS fabrication process that must be verified to maximize yield is the thickness of the thin films deposited on the sapphire substrate. However, due to the transparent nature of sapphire, current optical metrology tools are not applicable. In a Small Business Technology Transfer (STTR) Phase I, Advanced Cooling Technologies, Inc. (ACT) has developed and demonstrated an easy-to-use, non-contact and non-destructive instrument for performing thin film thickness measurements for SOS and related materials. This technique uses a novel alternative spectrographic technique to quickly and accurately determine thin film thicknesses with extreme accuracy. The proposed STTR Phase II program will further develop and mature the measurement methodology, and a full-scale instrument that can be integrated into an SOS wafer fabrication process will be designed and built.

* Information listed above is at the time of submission. *

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