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Hierarchical, Layout-Aware, Radiation Effects Tools Vertically Integrated into an EDA Design Flow for Rad-Hard by Design

Award Information
Agency: Department of Defense
Branch: Defense Threat Reduction Agency
Contract: HDTRA118C0040
Agency Tracking Number: T2-0311
Amount: $1,085,350.00
Phase: Phase II
Program: STTR
Solicitation Topic Code: DTRA16A-003
Solicitation Number: 2016.0
Solicitation Year: 2016
Award Year: 2018
Award Start Date (Proposal Award Date): 2018-07-05
Award End Date (Contract End Date): 2020-07-04
Small Business Information
725 Cool Springs Blvd, Suite 600
Franklin, TN 37067
United States
DUNS: 080126051
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Jeffrey Kauppila
 (615) 732-6073
Business Contact
 Lloyd Massengill
Phone: (615) 732-6072
Research Institution
 Vanderbilt University
 Janiece Harrison
PMB 407749 2301 Vanderbilt Place
Nashville, TN 37240
United States

 (615) 322-2631
 Nonprofit College or University

The goal of this workis to establish a radiation-aware capability in a commercial EDA design flow that will enable first-pass success in radiation resiliency for DoD ASIC designs in much the same way that existing EDA design suites ensure first pass functionality and performance success of complex ASICs destined for commercial applications.Such an integrated capability does not presently exist.The specifics proposed herein address the incorporation of radiation-inclusive compact models into a new circuit design tool, called VIRAD for Vertically-Integrated Radiation-Aware Design.This new tool will allow the prediction, during the design cycle, of radiation responses and failures prior to actual circuit fabrication in an advanced, or perhaps emerging, technology node.VIRAD will ultimately enable the optimization of complex designs for RHBD at a fraction of current resource expenditures by avoiding, or significantly reducing, the costly design-fabricate-test-redesign cycle that is customary in the radiation-hardened design community.

* Information listed above is at the time of submission. *

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