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New Crystalline Silicon Module Architecture to Reduce Costs withImproved Manufacturability andDurability
Phone: (970) 217-9434
Email: kbarth@direct-solar.com
Phone: (970) 217-9434
Email: kbarth@direct-solar.com
Contact: Tushar Shimpi
Address:
Phone: (303) 704-8884
Type: Nonprofit College or University
Direct Solar in partnership with Colorado State University's Next Generation PV Center (NGPV) and H. B. Fuller Company will develop a new solar module architecture and manufacturing process optimized for crystalline silicon (c-Si) modules that significantly reduces manufacturing costs and improves reliability. The outcome of this program will be a new c-Si module design, streamlined manufacturing process and accelerated stress test results showing improved reliability. Prototype manufacturing processes eliminating vacuum lamination will be demonstrated with cycle times of under 1.5 min. (compared to 13 min. for current industry methods). The new technology will lower manufacturing costs and reduce cap-ex by 3-5 times and reduce factory footprint by nearly 20 times. This technology will address reliability and durability issues currently facing crystalline silicon solar by: a. eliminating potential induced degradation, b. controlling moisture ingress with desiccants, and c. advancing a robust glass / glass package that minimizes cell breakage. The research will enable lower cost modules with higher reliability and durability needed to achieve the DOE Solar Energy Tech. Office (SETO) goals of 3 cents/kWh. During phase 1 of the effort 5 tasks will be accomplished: Application Process Development for the Silicone and Interlayer Encapsulation Materials Engineering and Design of Encapsulation Application Tools, Prototype Dispensing Experiments, Techno-Economic Analysis and Conceptual Design for GW/yr. Manufacturing, Dissemination of Results. Under this program, the new module architecture, prototype process demonstration, test results and IP portfolio will be developed sufficiently to enable licensing to equipment suppliers and OEM module manufactures for commercial product introduction.
* Information listed above is at the time of submission. *