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Tin Whisker Mitigation by Photonic Sintering for Sn-based Surface Finishes

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0147-10-C-7203
Agency Tracking Number: B08B-010-0020
Amount: $500,000.00
Phase: Phase II
Program: STTR
Solicitation Topic Code: MDA08-T010
Solicitation Number: 2008.B
Solicitation Year: 2008
Award Year: 2010
Award Start Date (Proposal Award Date): 2010-02-03
Award End Date (Contract End Date): 2012-02-02
Small Business Information
3006 Longhorn Blvd. Suite 107
Austin, TX 78758
United States
DUNS: 013475129
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Mohshi Yang
 PI/Chief Technical Officer
 (512) 339-5020
Business Contact
 Nancy Ruel
Title: Director, Contracts & Program Mgmt.
Phone: (512) 339-5020
Research Institution
 Center for Advanced Lifecycle Eng.
 Mike Osterman
Bldg 89, room 1103 University of Maryland
College Park, MD 20742
United States

 (301) 405-5323
 Nonprofit College or University

Missile Defense Agency is seeking new technologies to reduce the tendency to form tin whiskers in electronic assemblies and microelectronic devices. RoHS regulations enacted by the European Union have generated a global shift toward Pb-free electronic components and circuitry. Pb-free solders create reliability problems in military applications such as aircraft and missiles that are subject to highly stressed environments by exacerbating tin whisker formation. Applied Nanotech, Inc. has developed a novel technique to simultaneously remediate existing tin whiskers and modify the underlying structure to prevent new ones from growing. Following a successful Phase I program, ANI will continue to team with its strategic partners to provide increased validation and optimization of the process for tin whisker mitigation. The Phase II program has been designed to transition the technology into a manufacturable process for commercial integration.

* Information listed above is at the time of submission. *

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