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Additive Manufacturing Sensor Fusion Technologies for Process Monitoring and Control.

Award Information
Agency: Department of Defense
Branch: Defense Logistics Agency
Contract: SP4701-19-C-0041
Agency Tracking Number: L2-0222
Amount: $999,973.00
Phase: Phase II
Program: STTR
Solicitation Topic Code: DLA18A-001
Solicitation Number: 18.A
Timeline
Solicitation Year: 2018
Award Year: 2019
Award Start Date (Proposal Award Date): 2019-08-20
Award End Date (Contract End Date): 2021-08-19
Small Business Information
1270 North Fairfield Rd
Dayton, OH 45432
United States
DUNS: 004475216
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Jared Speltz
 Additive Manufacturing Research Engineer
 (937) 229-3164
 jared.speltz@udri.udayton.edu
Business Contact
 Diana Suchecki
Phone: (937) 426-2808
Email: DSuchecki@utcdayton.com
Research Institution
 University of Dayton Research Institute
 Claudette Groeber Claudette Groeber
 
300 College Park
Dayton, OH 45469
United States

 (937) 229-2919
 Nonprofit college or university
Abstract

This Phase II project aims to assemble the key set of sensor modalities that are needed to reliably view the key process anomalies and properties of laser powder bed fusion. The research team will down-select from the Phase I sensors investigated and integrate the sensors into a sensor fusion software package that facilitates data collection and synchronization, and eventually feedback control of the AM process. The research team will then prove the sensors see all key process variations, and perform robust effect of defect studies that will supply the data needed for developing accurate process windows, and hence closed-loop feedback control algorithms. Next the team will determine what corrective actions are needed to fix the specific process variations that occur and implement those actions in the software system. The algorithms and sensing techniques will be demonstrated against baseline builds on multiple AM systems to prove their validity and capability, and a plan for transitioning the technology into the DoD supply chain will be developed.

* Information listed above is at the time of submission. *

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