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Advanced Solutions for Radiation Susceptibility Analysis & Prediction

Award Information
Agency: Department of Defense
Branch: Defense Threat Reduction Agency
Contract: HDTRA119C0021
Agency Tracking Number: T2-0318
Amount: $999,007.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: DTRA162-006
Solicitation Number: 16.2
Solicitation Year: 2016
Award Year: 2019
Award Start Date (Proposal Award Date): 2019-01-15
Award End Date (Contract End Date): 2021-01-14
Small Business Information
1112 Montana Ave, STE 253
Santa Monica, CA 90403
United States
DUNS: 080331022
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Michel Sika
 (213) 326-7053
Business Contact
 Michel Sika
Phone: (213) 326-7053
Research Institution

With the advent of high-density low-power sub-20nm technology processes and circuits with tens-of-billions of transistors, radiation-induced single-event effects present a new set of design challenges for terrestrial applications. Developing reliable single-event effect resilient microelectronics in these modern technology nodes is a resource and time-intensive endeavor that further requires validation after fabrication. There are significant risks and costs involved in efficiently balancing radiation effects resiliency without losing performance benefits of the new technology nodes. Current analysis tools are not suited to performing the necessary single-event effect resiliency assessment on a scale appropriate for typical modern and future design sizes. With an approach involving current tools, computational requirements are intractable for anything larger than a very small design. Lucid Circuit is developing solutions for designs of all sizes in the form of a Radiation Susceptibility Analysis & Prediction platform or RSAPTM (patent pending). Our approach will help designers implement radiation effects resilient and technology optimized microelectronics in a cost effective manner with limited impact on schedules.

* Information listed above is at the time of submission. *

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