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Asynchronous Multi-transmitter Multi-aperture Synthetic 3D Imaging System

Award Information
Agency: Department of Defense
Branch: National Geospatial-Intelligence Agency
Contract: HM047619C0062
Agency Tracking Number: NGA-P1-19-04
Amount: $99,999.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: NGA183-001
Solicitation Number: 18.3
Solicitation Year: 2018
Award Year: 2019
Award Start Date (Proposal Award Date): 2019-07-10
Award End Date (Contract End Date): 2020-04-14
Small Business Information
15985 NW Schendel Avenue Suite 200
Beaverton, OR 97006
United States
DUNS: 124348652
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Mike Munroe
 Senior Engineer
 (971) 223-5646
Business Contact
 Debra Ozuna
Phone: (971) 223-5646
Research Institution

Traditional active 3D imaging systems, such as airborne and terrestrial lidar scanners, use a transmitter and receiver typically co-located on the same platform and connected in synchronous communications. However, recent advances in laser, detector, and airborne systems technology have opened the door to smaller, higher-performance and significantly lower-cost airborne lidar systems in which it is possible to decouple the transmitter and receiver functions of a lidar system. By relaxing the physical coupling and communication constraints on conventional active-imaging systems, it is possible to establish in-situ cooperation of independently-mobile discrete active-imaging components for the development of new revolutionary active-imaging-system architectures. To advance the possibilities of revolutionary active-imaging-system architectures, in this effort, Voxtel will develop bi-static lidar-system designs and concepts of operations (CONOPS) that allow one or more laser transmitters and one or more receivers to be disconnected and operating independently of each other while providing high-resolution 3D image capture. Our approach integrates the most recent advances in lasers, highly sensitive detector arrays, custom readout integrated circuits (ROICs), and advanced processing capabilities.

* Information listed above is at the time of submission. *

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