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Monolithic Beam-Combined Mid-Infrared Laser Array

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-19-C-0261
Agency Tracking Number: N11A-011-0235a
Amount: $499,972.00
Phase: Phase II
Program: STTR
Solicitation Topic Code: N11A-T011
Solicitation Number: 11.A
Timeline
Solicitation Year: 2011
Award Year: 2019
Award Start Date (Proposal Award Date): 2019-04-18
Award End Date (Contract End Date): 2020-07-15
Small Business Information
200 N. Prospect Ave.
Madison, WI 53726
United States
DUNS: 829814925
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Luke Mawst
 Professor
 (608) 332-2520
 mawst@engr.wisc.edu
Business Contact
 Lynda Botez
Phone: (608) 231-3432
Email: lbotez@intraband.net
Research Institution
 University of Wisconsin - Madison
 Kim Moreland Kim Moreland
 
Research and Sponsored Programs 21 N Park Street, Suite 6401
Madison, WI 53726
United States

 (608) 262-3822
 Nonprofit College or University
Abstract

Monolithic surface-emitting (SE) semiconductor lasers hold promise for significant advantages over edge-emitting lasers in terms of both reliable operation, scaling the CW single-mode output powers into the multi-watt range, and manufacturing cost. Grating-coupled (GC) surface emitters offer a path to achieving single-spatial-mode, single-frequency CW operation, with the added advantage that relatively high single-mode CW output powers can be obtained. The technical objectives of this proposal are: 1) Develop narrow-ridge, buried heterostructure surface-emitting (SE) QCLs for CW operation; (2) Integrate gratings into the Active Photonic Crystal (APC) QCL array for surface-emission; 3) Develop indium on diamond chip mounting for APC QCL arrays; 4) Characterize thermal management of packaged single and multi-element (APC) SE QCL devices: The goals are 1.5 W CW power and 15W average power, respectively; 5) Prototype demonstration of CW fully packaged SE single-element and array (APC) QCLs, which will be deliverables after completion of the program.

* Information listed above is at the time of submission. *

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