You are here

Fast Response Heat Flux Sensors and Efficient Data Reduction Methodology for Hypersonic Wind Tunnels

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA9550-19-C-0012
Agency Tracking Number: F17A-001-0135
Amount: $749,981.00
Phase: Phase II
Program: STTR
Solicitation Topic Code: AF17A-T001
Solicitation Number: 17.A
Solicitation Year: 2017
Award Year: 2019
Award Start Date (Proposal Award Date): 2019-09-15
Award End Date (Contract End Date): 2021-09-15
Small Business Information
100 Remington Blvd
Ronkonkoma, NY 11779
United States
DUNS: 078466424
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Nicholas Tiliakos
 Chief Engineer/Principal (Co-Owner)
 (631) 219-3483
Business Contact
 Robert Bakos
Phone: (631) 793-8439
Research Institution
 Dean Modroukas Dean Modroukas
100 Remington Blvd
Ronkonkoma, NY 11779
United States

 (631) 793-8436
 Domestic Nonprofit Research Organization

There is a DoD need for the development of robust sensors to obtain temporally and spatially resolved surface temperature and heat flux measurements on test articles in blowdown and continuous hypersonic wind tunnels. These micro-heat flux sensors are required in order to better understand the state of the boundary layer of a hypersonic vehicle; to better understand boundary layer instabilities; and to obtain high quality transitional and turbulent heat transfer data required for the design of hypersonic vehicles and CFD/model validation. Our proposed mQDOTT sensor system leverages MEMS technology to decrease the current state-of-the-art heat flux sensors’ form factor, providing reliable heat flux and surface temperature measurements in hypersonic aero-propulsion tunnels/vehicles, particularly in locations previously inaccessible. Such measurements are critical to understanding the hypersonic flowfield information that will ultimately be used to design hypersonic vehicles. The mQDOTT sensor system is comprised of the following components: (1) The Sensor Head comprised of the micro-heat flux sensing element and thin-film temperature element; (2) Electrical Connections integrated with (3) the sensor high temperature packaging, providing ease of implementation and ensuring the integrity of the instrumentation suite.

* Information listed above is at the time of submission. *

US Flag An Official Website of the United States Government