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Additive Manufactured Smart Structures with Discrete Embedded Sensors

Award Information
Agency: Department of Defense
Branch: Army
Contract: W56HZV-19-C-0002
Agency Tracking Number: A2-7240
Amount: $999,995.00
Phase: Phase II
Program: STTR
Solicitation Topic Code: A17A-T024
Solicitation Number: 17.A
Solicitation Year: 2017
Award Year: 2019
Award Start Date (Proposal Award Date): 2019-03-01
Award End Date (Contract End Date): 2021-03-01
Small Business Information
11008 Chelsea Way
Laurel, MD 20723
United States
DUNS: 080528211
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Victor E Yun
 (301) 256-5282
Business Contact
 Yongzhang Leng
Phone: (301) 793-8588
Research Institution
 University of Maryland at College Park
 Julius Goldhar Julius Goldhar
2122 Jeong H. Kim Engineering Building
College Park, MD 20742
United States

 (301) 405-3738
 Nonprofit College or University

Recent advances in 3D structure printing and 3D direct printed electronics have widened the scope of possibilities for the Internet of Things (IoT). New near room temperature 3D direct ink writing (DIW) additive manufacturing (AM) printing processes allow many different type of sensors and they can be embedded anywhere in a structure, which offers several benefits. 1. Protection: sensors face degradation from impact, heat exposure, corrosion, wear, and so on. 2. Design freedom: 3D printing enables electronics and conductive traces to be placed anywhere in a structure. 3. Anti-tampering: physically hiding devices and sensors inside a structure can be the best protection from manipulation, alteration, deactivation, and/or damage from the outside elements. The combination of subtractive (CNC milling) and additive (CNC extrusion) stages allows components to be integrated into existing parts and in some cases, allows complete manufacture of a part with sensors embedded during the manufacturing process. A major difference with a 3DFlexible (3DF) hybrid additive manufacturing (hAM) system, compared to other 3D printing technologies, is its low processing temperature. This is important when it comes to embedding sensors and electronics as these materials are easily damaged from the elevated temperatures for sintering metallic materials.

* Information listed above is at the time of submission. *

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