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Nano 3D Printing of Capillary Optics

Award Information
Agency: Department of Energy
Branch: N/A
Contract: DE-SC0020602
Agency Tracking Number: 0000257184
Amount: $1,099,958.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: 13a
Solicitation Number: N/A
Solicitation Year: 2021
Award Year: 2021
Award Start Date (Proposal Award Date): 2021-05-03
Award End Date (Contract End Date): 2023-05-02
Small Business Information
2800 Woodlawn Drive Ste 240
San Jose, CA 95131-1870
United States
DUNS: 038491002
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: Yes
Principal Investigator
 Jian Liu
 (408) 573-0930
Business Contact
 Shuang Bai
Phone: (408) 573-0930
Research Institution

Additive manufacturing (AM), esp. laser AM, becomes a powerful tool to replace conventional methods due to its cost effectiveness and capability of making complex structure and composition. However, direct fabrication of optics parts is still a challenging field, mainly due to limited understanding of process control, powder fabrication, and laser melting mechanism to eliminate defects and bubbles. Statement of how this problem or situation is being addressed. Based on our patented laser AM technology and the world’s first product of fs fiber laser AM, PolarOnyx proposes, for the first time, a glass AM/SM system to develop the optimal process to overcome these difficulties and meet the requirement of X-ray fluorescence microscopy. Phase I Results. Significant breakthroughs were made: Achieved high density (>99%) and excellent control for capillary structures, and filed one patent. Phase II Plan. PolarOnyx will develop and prototype nano-AM to make high quality and high resolution capillary optics. Commercial Applications and Other Benefits. In addition to the 3D AM applications (potential $44B market in 2025), material processing is another major commercial application for this project. This includes (1) Photonic device fabrications, such as waveguide, coupler, WDM, modulator, and switching; (2) all types of metal processing such as welding, cutting, annealing, and drilling; (3) semiconductor and microelectronics manufacturing such as lithography, inspection, control, defect analysis and repair, and via drilling; (4) other materials processing such as rapid prototyping, desk top manufacturing, micromachining, photofinishing, embossed holograms, and grating manufacturing.

* Information listed above is at the time of submission. *

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