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Photonic Integrated Analog-to-Information Receiver

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-21-C-0356
Agency Tracking Number: N21A-T004-0198
Amount: $139,994.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: N21A-T004
Solicitation Number: 21.A
Timeline
Solicitation Year: 2021
Award Year: 2021
Award Start Date (Proposal Award Date): 2021-04-12
Award End Date (Contract End Date): 2021-10-18
Small Business Information
41 Aero Camino
Goleta, CA 93117-3104
United States
DUNS: 191741292
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Steven Estrella
 (805) 967-4900
 steven@freedomphotonics.com
Business Contact
 Leif Johansson
Phone: (805) 967-4900
Email: leif@freedomphotonics.com
Research Institution
 Aerospace Federally Funded Research and Development Center
 George Valley
 
2310 E. El Segundo Blvd.
El Segundo, CA 90245-0000
United States

 (310) 606-0731
 Federally Funded R&D Center (FFRDC)
Abstract

As complexity and performance requirements increases for RF sensors and systems for electronic warfare applications, the need for innovative and low-power compressive sensing (CS) technologies will become urgent in power constrained mobile platforms. There are several DOD and government application areas where this holds true and the high-performance CS technology to be developed in this program can be utilized. As performance and maturity of CS hardware improves it is expected that even wider use within a wider range of DOD platforms will be advantageous. The overall objective of this program is to develop a prototype photonic-based CS analog-to-information receiver. Namely, a compact heterogeneously integrated module will be developed to co-integrate a custom photonic integrated circuit (PIC) and application specific integrated circuit (ASIC) together with best-in-class commercial electronics on a single compact circuit board substrate. The photonic integration platform proposed by Freedom Photonics will be of high impact with the potential to meet military needs for decades to come by offering an integrated optical solution which is entirely contained on chip level. This will make this technology similar and competitive to all electronic solutions in size and robustness.

* Information listed above is at the time of submission. *

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