Advanced Thermal Management of Power Converters

Advanced sensors and effectors are driving shipboard power distribution systems toward higher voltages, resulting in greater thermal demands on the power conversion modules.  Wide Bandgap (WBG) semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN), can be utilized to reduce thermal inefficiencies with high-frequency switching topologies, but heat generation is still a primary limiting factor.  In this STTR program, advancements in thermal packaging technology are sought to enable higher power density, lower cost systems.  In particular, thermal/electrical co-design is desired for compatibility with state-of-the-art (SoA) WBG devices.  Advanced Cooling Technologies, Inc. (ACT), Washington University in St. Louis (WU), and RCT Systems, Inc. (RCT) propose to develop a thermal management system using novel flow passage geometries enabled by additive manufacturing to achieve high thermal performance. The proposed concept expands ACT’s core product line in thermal management systems for military shipboard applications.