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Integrated Reduced-Expansion Microchannel Cooling for SiC Power Modules

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-21-C-0428
Agency Tracking Number: N21A-T012-0144
Amount: $139,997.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: N21A-T012
Solicitation Number: 21.A
Timeline
Solicitation Year: 2021
Award Year: 2021
Award Start Date (Proposal Award Date): 2021-06-07
Award End Date (Contract End Date): 2021-12-07
Small Business Information
7522 Slater Ave., Suite 122
Huntington Beach, CA 92647-1111
United States
DUNS: 001557268
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 David Underwood
 (714) 227-9025
 daveunderwood@microcoolingconcepts.com
Business Contact
 David Underwood
Phone: (714) 227-9025
Email: daveunderwood@microcoolingconcepts.com
Research Institution
 University of Arkansas
 Alan Mantooth
 
1475 W. Cato Springs Rd.
Fayetteville, AR 72701-6771
United States

 (479) 575-4838
 Nonprofit College or University
Abstract

High power semiconductor devices suffer from difficulty in dissipating heat and thermal stresses. Silicon carbide-based power modules, in particular, have increasingly challenging heat loads despite their high efficiencies. In general terms, the module packaging methods used to improve cooling (moving metal heatsinks closer to the die) also increase thermal stresses, and the methods used to reduce stresses (introducing ceramics or compliant bonds between the heatsink and the die) make cooling more difficult.   In the proposed effort, microchannel cooling passages will be introduced into a reduced thermal expansion metal such as molybdenum/copper, and this cooling system will be packaged as the baseplate of existing silicon carbide power modules. This reduces thermal stresses and improves thermal performance compared to conventional methods, resulting in a package capable of dissipating more than 500 W/cm2.   The Phase I will optimize the microchannel and flow distribution designs, build prototypes, and begin development of a silicon carbide power module suitable for testing at high heat fluxes in Phase II. The Phase I Option will evaluate the prototypes and finalize the design and fabrication plan for the power module to be built in Phase II.

* Information listed above is at the time of submission. *

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