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Helmet-mounted Radar Detector (HMRD)

Award Information
Agency: Department of Defense
Branch: Army
Contract: W911QY-22-C-0016
Agency Tracking Number: A2-9072
Amount: $1,149,998.00
Phase: Phase II
Program: STTR
Solicitation Topic Code: A20B-T024
Solicitation Number: 20.B
Timeline
Solicitation Year: 2020
Award Year: 2022
Award Start Date (Proposal Award Date): 2022-02-09
Award End Date (Contract End Date): 2024-02-08
Small Business Information
52 Geiger Road, Suite 2
Rome, NY 13441-4319
United States
DUNS: 806603515
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: No
Principal Investigator
 Walter E. Szczepanski
 (315) 356-1661
 walter.szczepanski@heliossensors.com
Business Contact
 Janine Szczepanski
Phone: (315) 356-1668
Email: janine.szczepanski@heliossensors.com
Research Institution
 Michigan Technological University
 Marilyn Haapapuro
 
1400 Townsend Drive
Houghton, MI 49931-0001
United States

 (906) 487-2228
 Nonprofit College or University
Abstract

Helios Remote Sensing Systems, Inc. proposes to design, fabricate, and demonstrate a radar early warning receiver for the dismounted soldier’s uniform, armor or battle kit that identifies and locates Ground Surveillance Radar (GSR) threats.  In Phase II we plan to demonstrate the feasibility of the technical approach through demonstrations of the Phase I designs, including breadboard or demonstration board of electronic components, signal processing, electronic integration with uniform, armor, or soldier kit, and detailed plans for placement as well as size, weight and power.  The sensor will capture sufficient information to identify the GSR system from a library of waveforms.  The system will be able to find angle of arrival and estimate of the location relative the user.  The system will perform for signals in the X and Ku bands (8-18 GHz).  Phase II deliverables will include, (1) a final report detailing technical approach, design, implementation, tests, data analysis, conclusions, and proposed path for integration with the soldier’s kit; (2) All test data; (3) Working breadboard prototypes with software.

* Information listed above is at the time of submission. *

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