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3D Reinforced C/SiC

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0860-22-C-7105
Agency Tracking Number: B2-3103
Amount: $1,466,756.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: 9.2
Solicitation Number: NOAA-OAR-OAR-TPO-2021-2006702
Solicitation Year: 2021
Award Year: 2022
Award Start Date (Proposal Award Date): 2022-02-11
Award End Date (Contract End Date): 2024-02-10
Small Business Information
20 New England Business Center
Andover, MA 01810-1111
United States
DUNS: 073800062
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 John Steinbeck
 (978) 738-8148
Business Contact
 B. David Green
Phone: (978) 689-0003
Research Institution

Physical Sciences Inc. (PSI) proposes to advance the Direct Z-Pin Insertion (DZI) process for local application of 3D reinforcements in high temperature composite structures (2000F-4500F). The DZI process inserts rigid composite pins normal (through thickness) to a 2D polymer composite preform prior to cure. DZI is designed to affordably provide the needed 3D reinforcement yet enable 2D laminate design and fabrication. The pins improve both interlaminar tension and shear strength in the final composite structure. During the Phase II program PSI will optimize DZI process parameters to maximize enhancements to the interlaminar properties of high temperature C-SiC CMC. The DZI process is performed at the polymer composite level making the capability applicable to other material forms such as C-C. In addition to enhancing interlaminar strength, DZI is a valuable process aid for homogenizing the through thickness density of thick laminates by providing pathways for gas exit and polymer reinfiltration. Benefits of applying DZI as a preform stabilization tool to avoid ply wrinkling will also be demonstrated. An economic analysis, identifying DZI automation requirements for greater affordability, will be provided. Interaction with OEMS will define demonstration articles that can be built and tested during a Phase III program. Approved for Public Release | 22-MDA-11102 (22 Mar 22)

* Information listed above is at the time of submission. *

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