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Open Topic for Radiation Hardened Microelectronics

Description:

OUSD (R&E) CRITICAL TECHNOLOGY AREA(S): Microelectronics The technology within this topic is restricted under the International Traffic in Arms Regulation (ITAR), 22 CFR Parts 120-130, which controls the export and import of defense-related material and services, including export of sensitive technical data, or the Export Administration Regulation (EAR), 15 CFR Parts 730-774, which controls dual use items. Offerors must disclose any proposed use of foreign nationals (FNs), their country(ies) of origin, the type of visa or work permit possessed, and the statement of work (SOW) tasks intended for accomplishment by the FN(s) in accordance with the Announcement. Offerors are advised foreign nationals proposed to perform on this topic may be restricted due to the technical data under US Export Control Laws. OBJECTIVE: The objective of this open topic is to solicit potentially valuable small business Radiation Hardened Microelectronics (RadHard ME) focused innovations to missile defense and create an opportunity to expand the relevance of the STTR programs to firms who do not normally compete for STTR awards. DESCRIPTION: Radiation hardened electronics are critical for many missile defense platforms. Missile defense applications have a need to operate in stressing natural and man-made environments. While this RadHard ME open topic may accept proposals on any technical challenge requiring a RadHard ME application, the government is seeking submissions that address the following: • Radiation Effects- including Heavy Ion, X-ray Proton, and Pulsed Neutron Single Event Effects on Electronic Devices • New single event effects (SEE) test methodologies, techniques, technologies, or alternate particle sources such as using LASERs • Modeling and simulation methodologies to evaluate and distinguish between radiation effects from a persistent beta and gamma environment, and determine the circumstances where testing for one environment is sufficient to show survivability in the other, or in a combined environment • Modeling and simulation methodologies to predict radiation damage to microelectronics and evaluate microelectronics for survivability in radiation environments • Develop test methodologies to evaluate and distinguish between radiation effects from a persistent beta and gamma environment, and determine the circumstances where testing for one environment is sufficient to show survivability in the other, or in a combined environment • System component health monitoring during radiation events to determine impacts of effects and application of automatic annealing techniques to maintain system operation • Automated test software to improve testing speeds, to include the use of Artificial Intelligence/Machine Learning (AI/ML) • Radio frequency (RF) communications in a radiation environment • Radhard ME optimized for size, weight, and power (SWaP) • Radiation hardened inertial measurement units (IMUs) suitable for hypersonic flight, Focal Plane Arrays (FPAs), Readout Integrated Circuits (ROICs), processors, memory, mixed-signal analog parts, optics & coatings, and power parts that meet the following specifications: Total Ionizing Dose (>= 1 megarad (SiO2)), Single Event Upset Rate (1E-10 (errors/device-day)), Single Event Latch-Up (>=90 (Linear Energy Transfer)), Dose Rate Upset (>=1E10 (rad(Si)/s)), Dose Rate Survivability (>=1E12 (rad(Si)/s)), Displacement Damage (fluence of >=1E14, with 1MeV energy equivalent neutrons/cm2)). PHASE I: Conduct a feasibility study to demonstrate the technical and commercial practicality of the concept to include an assessment of its technical readiness and potential applicability to military and commercial markets. PHASE II: Complete a prototype incorporating Government performance requirements, and demonstrate said prototype. Coordinate with the Government during prototype design and development to ensure that the delivered products would be relevant to ongoing missile defense architecture needs. PHASE III DUAL USE APPLICATIONS: Conduct engineering and manufacturing development, test, evaluation in a realistic system environment or in a system level test-bed. The various technologies and models should have applicability to the defense industry. Model and simulations should be verified, validated, and accredited. REFERENCES: 1. MDA22-D001: Radiation Hardened Microelectronics Storefront: https://www.sbir.gov/node/2120611 2. James R. Schwank, Marty R. Shaneyfelt, and Paul E. Dodd, “Radiation Hardness Assurance Testing of Microelectronic Devices and Integrated Circuits: Radiation Environments, Physical Mechanisms, and Foundations for Hardness Assurance,” IEEE Transactions on Nuclear Science, Vol. 60, No. 3, June 2013. 3. Cladis, Davidson, and Newkirk, eds, “The Trapped Radiation Handbook,” NDA 2534H, Washington, DC, https://apps.dtic.mil/sti/pdfs/ADA020047.pdf. 4. Schultz and Hjalmarson, From first-principles defect chemistry to device damage models of radiation effects in III-V semiconductors, MMM 2018, Osaka, Japan, https://www.osti.gov/biblio/1593578. 5. Huang et al, Multi-Timescale Microscopic Theory for Radiation Degradation of Electronic and Optoelectronic Devices, American Journal of Space Science, 2015. https://thescipub.com/abstract/ajssp.2015.3.27 Nordland et al, Primary radiation damage: A review of current understanding and models, Journal of Nuclear Materials, 512 (2018) 450-479, https://www.osti.gov/pages/biblio/1482433. 6. Broberg et al, PyCDT: A Python toolkit for modeling point defects in semiconductors and insulators, Computer Physics Communications 226 (2018) 165-179. https://www.sciencedirect.com/science/article/pii/S0010465518300079. 7. Nordland et al, Primary radiation damage: A review of current understanding and models, Journal of Nuclear Materials, 512 (2018) 450-479, https://www.osti.gov/pages/biblio/1482433. 8. Radiation Effects on Electronics 101: https://nepp.nasa.gov/DocUploads/392333B0-7A48-4A04-A3A72B0B1DD73343/Rad_Effects_101_WebEx.pdf. Approved for Public Release (topic) 23-MDA-11540 (18 Jul 23) KEYWORDS: Radiation hardening; microelectronics, modeling and simulation, radiation testing, radiation test methodology, x-ray, gamma ray, proton, neutron, single event effects, inertial measurement units, focal plane arrays, readout integrated circuits, Artificial Intelligence, Machine Learning; Open topic
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