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Scanning LDV System for Modeling Vibration and Acoustics

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N/A
Agency Tracking Number: 36980
Amount: $69,342.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Solicitation Year: N/A
Award Year: 1997
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
14240-G Sullyfield Circle
Chantilly, VA 20151
United States
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 David E. Montgomery
 (703) 818-1990
Business Contact
Phone: () -
Research Institution

Nomura Enterprise Inc. (NEI) proposes to extend a novel research technology, Laser-Based Spatial Dynamics Modeling (LSDM) for the solution of 3-D velocity fields over submerged structures using a scanning laser Doppler vibrometer (SLDV). NEI will be assisted by the Structural Imaging and Modal Analysis Laboratory of Virginia Tech. LSDM technology exploits high spatial density noncontact SLDV measurement capability coupled with a new finite element to solve for complex-valued 3-D velocity fields. This research has already been demonstrated on shell and tire structures. Five fundamental concepts uniquely separate LSDM from other approaches: (1) the 3-D result is a spatially continuous field, (2) the finite element mesh solves for the 3-D velocity field over a structure simultaneously, (3) the solution is converged by mesh refinement and statistically qualified, (4) arbitrary geometries are naturally accommodated through finite element meshing, and (5) the technology can be taken into the field. The 3-D field solution allows postprocessing to extract angular velocities, displacements, dynamics strains, and structural intensity. A very powerful LSDM application uses the 3-D velocity field solution as the prescribed velocity boundary condition for acoustic analysis. This application of LSDM will be developed and demonstrated on structures at a U.S. Navy facility.

* Information listed above is at the time of submission. *

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