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Solder Plating Process Control

Award Information
Agency: Department of Defense
Branch: Army
Contract: N/A
Agency Tracking Number: 20598
Amount: $49,030.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Solicitation Year: N/A
Award Year: 1993
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
2906 Fm 720 East
Frisco, TX 75034
United States
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Lawrence D. Harvey
 (214) 335-9841
Business Contact
Phone: () -
Research Institution

The objective of this proposal is to develop and implement a scientifically based solderability tester as a process control tool during the fabrication process for printed circuit boards. Using the sequential electrochemical reduction analysis (SERA) process as invented by Rockwell International, data will be gathered to correlate the coulomb density values determined by SERA to current, commercial solderability testing as described in IPC-5-804. Designed experimentation methods will be used to determine the key process characteristics that can be controled as a result of the information available through the SERA test method. In addition, the SERA test equipment will be evaluated for its ability to withstand the normal production environment and possible design improvement recommendations will be made to enhance its ability to withstand the environment.

* Information listed above is at the time of submission. *

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