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Ultra-High Resolution X-Ray Spectrometer for Chemical Information in Electron Beam Micro-Analysis

Award Information
Agency: Department of Energy
Branch: N/A
Contract: DE-FG02-06ER84400
Agency Tracking Number: 81288S06-I
Amount: $86,658.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: 25
Solicitation Number: DE-FG01-05ER05-28
Timeline
Solicitation Year: 2005
Award Year: 2006
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
P.O. Box 12212
Tallahassee, FL 32317
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 David O'Hara
 Mr.
 (850) 580-5481
 prlax@mindspring.com
Business Contact
 David O'Hara
Title: Mr.
Phone: (850) 580-5481
Email: prlax@mindspring.com
Research Institution
N/A
Abstract

For electron beam micro-analysis, used in DOE facilities for materials science research, a spectrometer is needed that can discern various types of chemical bonds in samples. These distinctions are very difficult to obtain without the use of very expensive instrumentation. This project will develop a double-diffractor x-ray spectrometer for electron beam micro-analysis to enable ultra-high-resolution x-ray spectroscopy for chemical analysis. The spectrometer ¿ which will utilize a previously-developed, parallel-beam x-ray spectrometer based on highly efficient x-ray collimation optics ¿ will enable a simple optically-efficient design that can be mounted on a scanning electron microscope. Users would be able to obtain desired chemical information at the same time they were getting elemental and image information about micro-features. Phase I will address issues associated with theoretical aspects, along with issues associated with operation and alignment, and then design the spectrometer for construction in Phase II. Commercial Applications and Other Benefits as described by the awardee: The new spectromether would enhance the use of electron beam facilitities for such applications as dopant mapping and depth profiling in Si wafers; determination of carbon bonding types in micro-features; and general chemical bonding mechanisms in micro-features.

* Information listed above is at the time of submission. *

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