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High Resolution Imaging Ellipsometer for Labeless, Multi-Channel Immunosensing

Award Information
Agency: Department of Defense
Branch: Office for Chemical and Biological Defense
Contract: N/A
Agency Tracking Number: 40399
Amount: $99,992.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Solicitation Year: N/A
Award Year: 1998
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
2520 W. 237th Street, R & D Division
Torrance, CA 90505
United States
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Lothar U. Kempen, Ph.d.
 (310) 530-7130
Business Contact
Phone: () -
Research Institution

We propose to develop a real-time imaging optical arrangement monitoring a sample solution for a large number of analytes in parallel. Using a photo-induced immobilization technique, a multitude of different antibodies is immobilized on the surface of a glass carrier, each type located at a specific position on the chip. When sample fluid containing the analytes lows over the sensor surface, the top plane of the optical carrier chip is interrogated from below by an imaging ellipsometer to provide a spatially resolved measurement of the sample surface in approximately one second. This allows precise monitoring of the film thickness variations due to a binding event with monolayer resolution. The use of several spectral bands for performing the measurement adds another parameter in addition to film thickness determination to enhance the sensitivity. The imaging will be performed with about 10 micrometer lateral resolution, leading to highly resolved fast information about the binding status of a vast number of different antibodies without the need for labeling reagents. The optical setup can also be used with minor modifications to monitor DNA binding events. This system will be of high commercial interest for chemical and biological screening and for environmental monitoring applications.

* Information listed above is at the time of submission. *

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