You are here

A 1920x1080 Pixel Visible and Shortwave Infrared Focal Plane Array and Camera for Night Vision Imaging

Award Information
Agency: Department of Defense
Branch: Army
Contract: W15P7T-05-C-H202
Agency Tracking Number: A043-116-2830
Amount: $119,995.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: A04-116
Solicitation Number: 2004.3
Timeline
Solicitation Year: 2004
Award Year: 2005
Award Start Date (Proposal Award Date): 2004-12-13
Award End Date (Contract End Date): 2005-06-13
Small Business Information
3490 U.S. Route 1, Building 12
Princeton, NJ 08540
United States
DUNS: 784084394
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 J. Christopher Dries
 VP, Research & Development
 (609) 524-0257
 jcdries@sensorsinc.com
Business Contact
 Marshall Cohen
Title: President & CEO
Phone: (609) 524-0236
Email: mcohen@sensorsinc.com
Research Institution
N/A
Abstract

Sensors Unlimited will design, develop, and deliver a 1920x1080 element InGaAs focal plane array based camera for use in BOTH the Visible and Shortwave Infrared (SWIR) wavelength bands. Using Sensors Unlimited's proven InP substrate removal process, the short wavelength response of an InGaAs focal plane array is extended, such that the wavelength response spans from the visible (400 nm and 20% quantum efficiency) to the SWIR (1700 nm and 80% quantum efficiency). In addition, a readout integrated circuit architecture with in-pixel current amplification is utilized to achieve "noiseless" gains similar to those obtained by charge multiplying CCD image sensors. During phase I, our current 640x512 buffered input gate modulated readout integrated circuit architecture will be scaled to the 1920x1080 format at the schematic and modeling design level, with circuit layout taking place during the Phase I option period. In addition, we will demonstrate 1920x1080 pixel bump bonding technology with substrate removal on a 12.5 micron pixel pitch during Phase I. During Phase II, the readout integrated circuit and substrate removed InGaAs photodiode arrays will be fabricated and mated to miniature camera electronics, similar to our existing 320x256 MicroCamera platform.

* Information listed above is at the time of submission. *

US Flag An Official Website of the United States Government