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Innovative Manufacturing Process Improvements

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0006-05-C-7195
Agency Tracking Number: 044-1253
Amount: $96,732.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: MDA04-111
Solicitation Number: 2004.4
Timeline
Solicitation Year: 2004
Award Year: 2005
Award Start Date (Proposal Award Date): 2005-03-28
Award End Date (Contract End Date): 2005-09-28
Small Business Information
102 TRIBBLE DRIVE
MADISON, AL 35758
United States
DUNS: 122031883
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: No
Principal Investigator
 JASON GJESVOLD
 ANALYTICAL LAB MANAGER
 (256) 705-5531
 JGJESVOLD@SOLDERINGTECH.COM
Business Contact
 MARK MCMEEN
Title: V.P. OF ENG.
Phone: (256) 705-5515
Email: MMCMEEN@SOLDERINGTECH.COM
Research Institution
N/A
Abstract

Imbedded Component / Die Technology (IC/DT) A 3-D Modular Designed CCA: The need for high reliability electronic military systems coupled with reduced size and weight factors has demanded the evolution of circuit card manufacturing technology for miniturizing and assembling printed circuit card assemblies into standard modular designed configurations. IC/DT will advance electronics manufacturing to the next generation by transforming 2-D component assemblies into 3-D modular CCA'S. IC/DT SUBSTITUTES PLACEMENT OF COMPONENTS ON THE SURFACE OF AN ORGANIC SUBSTRATE ONTO OR NEAR A RIGID, THERMALLY CONDUCTIVE CORE UTILIZING MULTI-LEVEL CAVITIES. The elimination of all external component level secondary packaging further increases reliability by reducing mass and the number of opportunities for electrical interconnect failure.The use of bare die and thick/thin film components reduces both overall mass /weight and CCA size. IC/DT improves form and fit factors with increased component to substarte ratio allowing for smaller CCA's or for the addition of redundant systems to increase relaibility for hi-rel applications. Flexible interconnects from component to component or component to substrate, coupled with vibration - dampening encapsulant, allow for reliable use in high vibration and / or G-Force environments. Replacing solder interconnects, as the mechanoical and electrical attachment material, with conductive adheasives /epoxies and wire bonds allows for a more efficient interconnect media. The use of IC/DT when assembling CCA's can dramatically improve reliability and also improve form and fit factors by building CCA's in a modular 3-D configuration. THE FOLLOWING COMPANIES TPOC'S ARE REFERENCED FOR ADDING THEIR SUPPORT AND HELP TO THIS SBIR ENDEAVOR: LOCKHEED MARTIN LEN LACROIX, BAE GEORGE BURRUSS, AND HONEYWELL PATRICIA DARE.

* Information listed above is at the time of submission. *

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