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Innovative Manufacturing Process Improvements

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0006-06-C-7342
Agency Tracking Number: 044-1253
Amount: $749,701.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: MDA04-111
Solicitation Number: 2004.4
Timeline
Solicitation Year: 2004
Award Year: 2006
Award Start Date (Proposal Award Date): 2006-08-29
Award End Date (Contract End Date): 2008-08-29
Small Business Information
102 Tribble Drive
Madison, AL 35758
United States
DUNS: 122031883
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: No
Principal Investigator
 Casey Cooper
 Electrical Engineering Ma
 (256) 705-5511
 ccooper@stielectronicsinc.com
Business Contact
 Mark McMeen
Title: VP of Engineering Service
Phone: (256) 705-5515
Email: mmcmeen@stielectronicsinc.com
Research Institution
N/A
Abstract

Miniaturizing electronic packaging is critical to the advancement of electronics design and capability. Smaller, denser packages are required to increase data processing capability of current systems. The objective of the research project is to continue development of increased signal processing capability for interceptor electronics while maintaining low junction temperatures for improved performance and reliability. In Phase I, a conceptual design was proposed for miniaturizing an existing massive parallel image processor that currently utilizes four FPGA’s to allow for a 400% increase in processing elements over current planar designs within the same physical envelope. This increase in CPU’s for processing focal plane array data enhances weapon system capability and reliability. Phase II will pursue a manufacturing and assembly redesign of the parallel processing array electronics assembly using STI’s Imbedded Component/Die Technology. The proposed method of stacking bare die interposer modules, thermally coupled to an inner thermal core or lid, provides passive cooling for true miniaturization with integrated thermal management. An engineered prototype shall be delivered as a proof of principle demonstration for future testing and integration into a missile defense system.

* Information listed above is at the time of submission. *

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