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Integrated Avionics Manufacturing Concept: Imbedded Component/Die Technology (IC/DT)

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0006-06-C-7469
Agency Tracking Number: 053-0343
Amount: $97,953.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: MDA05-019
Solicitation Number: 2005.3
Timeline
Solicitation Year: 2005
Award Year: 2006
Award Start Date (Proposal Award Date): 2006-05-01
Award End Date (Contract End Date): 2006-11-30
Small Business Information
102 Tribble Drive
Madison, AL 35758
United States
DUNS: 122031883
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: No
Principal Investigator
 Casey Cooper
 Electrical Engineering Manager
 (256) 705-5511
 ccooper@stielectronicsinc.com
Business Contact
 Mark McMeen
Title: VP of Engineering Services
Phone: (256) 705-5515
Email: mmcmeen@stielectronicsinc.com
Research Institution
N/A
Abstract

The need for increased reliability coupled with reduced size and weight has demanded the evolution of manufacturing process technologies for printed circuit board assembly. Imbedded Component/Die Technology (IC/DT) will advance electronics packaging to the next level by transforming two-dimensional component placement into a three-dimensional (3-D) assembly with integrated thermal management. IC/DT enables the 3-D configuration of multiple systems thus achieving the cost/weight ratio advantage of using the smallest form and fit factor components available in a circuit card assembly. The objective of this research project is to develop a conceptual design using IC/DT to improve component performance, system capability, and product reliability of advanced interceptor seeker electronics. Removal of component-level packaging reduces assembly weight, electrical failure opportunities, electrical and thermal impedance, and valuable circuit card real estate. In Phase I, a manufacturing and assembly design methodology will be developed to integrate multiple advanced interceptor seeker electronics, such as the seeker IMU and image processor, into a high-density, miniaturized, light weight assembly. In collaboration with LMSSC, MSSA, and IBSi, a low-cost, highly-integrated, high-performance avionics package for the MKV kill vehicle shall be developed. This design methodology may be applied to a myriad of military interceptor products.

* Information listed above is at the time of submission. *

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