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Advanced, Low Cost, Integrated Avionics

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0006-06-C-7341
Agency Tracking Number: 044-1262
Amount: $700,000.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: MDA04-116
Solicitation Number: 2004.4
Timeline
Solicitation Year: 2004
Award Year: 2006
Award Start Date (Proposal Award Date): 2006-08-29
Award End Date (Contract End Date): 2008-08-29
Small Business Information
102 Tribble Drive
Madison, AL 35758
United States
DUNS: 122031883
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: No
Principal Investigator
 Casey Cooper
 Electrical Engineering Ma
 (256) 705-5511
 ccooper@stielectronicsinc.com
Business Contact
 Mark McMeen
Title: VP of Engineering Service
Phone: (256) 705-5515
Email: mmcmeen@stielectronicsinc.com
Research Institution
N/A
Abstract

Imbedded Component/Die Technology provides a complete solution for mission critical electronics coupling high-density electronics with passive thermal management. Imbedded Component/Die Technology allows the 3-D configuration of multiple systems thus achieving the cost/weight ratio advantage of using the smallest form and fit factor components available in a circuit card assembly. The objective of this research project is to continue development of a miniaturized, lightweight system for integrated seeker electronics using IC/DT. In Phase I, a conceptual design of a miniaturized SPAR-X electronics assembly was proposed producing a smaller, denser, more robust assembly with integrated, passive thermal management. Utilizing bare die reduces weight, electrical failure opportunities, electrical and thermal impedance, and valuable circuit card real estate allowing the population of additional components within the same envelope or a design shrink for smaller vehicles. Phase II will entail a redesign of the SPAR-X electronics system using IC/DT to exploit the benefits of unpackaged components namely bare die. The SPAR-X assembly shall be designed and manufactured resulting in an engineered prototype as a proof of principle demonstration.

* Information listed above is at the time of submission. *

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