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Advanced Packaging Concept: Imbedded Component/Die Technology (IC/DT)

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N00039-08-C-0048
Agency Tracking Number: 053-0343
Amount: $798,871.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: MDA05-019
Solicitation Number: 2005.3
Timeline
Solicitation Year: 2005
Award Year: 2007
Award Start Date (Proposal Award Date): 2007-10-02
Award End Date (Contract End Date): 2009-10-02
Small Business Information
102 Tribble Drive
Madison, AL 35758
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: No
Principal Investigator
 Casey Cooper
 Electrical Engineering Ma
 (256) 705-5511
 ccooper@stielectronicsinc.com
Business Contact
 Mark McMeen
Title: VP of Engineering Service
Phone: (256) 705-5515
Email: mmcmeen@stielectronicsinc.com
Research Institution
N/A
Abstract

Increasing requirements for software defined radios (SDR), such as those developed for Joint Tactical Radio System (JTRS), call for reduced size, lighter weight hardware in which to implement this next generation radio communication system. Today’s conventional circuit card assembly (CCA) packaging technologies, i.e. plated through-hole (PTH) and surface mount technology (SMT), are struggling to handle the increased heat dissipated by the high power electronic components within the radio’s small form factor. New manufacturing and assembly approaches are required to mitigate the excess thermal energy and meet the size, weight, and power (SWAP) design requirements. Current JTRS radio designs problems are not driven by circuit design capabilities but by an inability to package these circuits within the space constraints. STI Electronics proposes the use of its innovative packaging technology, Imbedded Component/Die Technology (IC/DT), in order to meet the critical design requirements of these size and power constrained radios. IC/DT involves imbedding unpackaged components, also known as bare die, into cavities within the laminate substrate with placement of high power devices directly to an imbedded cooling core. The Phase II effort will include a feasibility analysis of the Multifunctional Information Distribution System for JTRS (MIDS-J) radio’s targeted CCAs, an IC/DT manufacturing and assembly design, and a scaled-prototype to demonstrate IC/DT’s capability of resolving SWAP problems for JTRS radios.

* Information listed above is at the time of submission. *

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