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Vacuum-assisted MIMIC for EMI grid application on spinel domes

Award Information
Agency: Department of Defense
Branch: Army
Contract: W31P4Q-09-C-0086
Agency Tracking Number: A082-035-1395
Amount: $119,931.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: A08-035
Solicitation Number: 2008.2
Solicitation Year: 2008
Award Year: 2008
Award Start Date (Proposal Award Date): 2008-11-20
Award End Date (Contract End Date): 2009-05-20
Small Business Information
133 Defense Highway, Suite 212
Annapolis, MD 21401
United States
DUNS: 153908801
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: No
Principal Investigator
 Todd Heil
 Research Scientist/Engineer
 (410) 987-8988
Business Contact
 Sharon Fehrenbacher
Title: CEO
Phone: (410) 224-3710
Research Institution

Soft lithography is an inexpensive and fast method for applying micropatterned structures to both flat and nonplanar substrates. A vacuum-assisted Micromolding in Capillaries (MIMIC) technique will be developed to print a fine electromagnetic interference (EMI) grid on the inner surface of transparent spinel domes. A photocurable silver filled resin will infiltrate an EMI grid channel patterned on the surface of an elastomeric stamp using vacuum-assisted MIMIC. After exposure to ultraviolet light, the silver resin will cure and then be subjected to furnace treatments to burn off the polymer and densify the silver grid. After densification, the EMI grid will have a low sheet resistance obtained by tailoring the thickness of the gridlines. It is anticipated that this process will significantly reduce the cost of EMI grid application on transparent spinel domes.

* Information listed above is at the time of submission. *

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