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Large 10Gb/s Bandwidth electrical connector technology and process of producing same.

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: DASG60-02-P-0295
Agency Tracking Number: 02-0014T
Amount: $64,286.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Solicitation Year: N/A
Award Year: 2002
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
204 Brand Farm Dr.
So. Burlington, VT 05403
United States
DUNS: 113701002
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Bernard Tolmie
 (802) 859-9587
Business Contact
 Bernard Tolmie
Title: Presidaent
Phone: (802) 859-9587
Research Institution
 University of Vermont
 Beverly Blakeney
85 So. Prospect St.
Burlington, VT 05401
United States

 (802) 656-1922
 Nonprofit College or University

A new technology for the manufacture of 10Gb/s electrical/electronic connectors. The new manufacturing process has the potential of producing a low cost, large bandwidth,high dentsity of contacts in a robust and thermally tolerant package. The connector isMetallic and is extruded in a coniguous housing having multiple cavities for a plurality of contacts. Thus the rectangular connector is survivable in harsh EMI, thermal and mechanical enviornments. The Phase 1 program will deliver drawings, a mechanicalmock-up and computer simulated electrical performance. In this manner Phase 1 will produce required material for a successful Phase 2 where working prototypes and preproduction connectors will be produced. The proposed electrical and electronicconnectormeets sever military requirements and andd have low production costs for commercial applications. the proposed technology has the potential of high connector througput at low component cost. additionally, the technology has the potential ofsignificant performance at lower cost then conventional connector manufacturing technology.

* Information listed above is at the time of submission. *

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